Model
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– HB652I3H-R680-AI2 (non-WiFi) (1* HAILO-8™ Card / 52 TOPS)
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CPU/Chipset
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– Intel® 13th LGA1700 Socket Core i9/i7/i5/i3/Pentium/Celeron Processor (Max. TDP 65W)
– Intel R680E Chipset
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MB Model
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– MI3H-R6802 (TPM2.0)
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BIOS
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– AMI Flash ROM BIOS
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Memory
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– 2* DDR5 5600MHz Dual Channel SO-DIMM up to 64GB
|
Network
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– 1* Intel i225-V 2.5GbE
– 1* Intel i225-LM 2.5GbE
|
Grapics
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– Intel® HD Graphics, shared memory
– 1* HDMI
|
Audio
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– HD audio: Realtek ALC897/ALC888S (with 3W Amp.)
|
Storage
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– 2* M.2 M-key (2242/2280, PCIe Gen.4×4) support NVMe
– 1* 2.5” SATA Device
|
Expansion
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– 1* M.2 E-key (2230, PCIe Gen.3×1/USB2.0) support CNVio
– 1* M.2 B-key (3042/3052, USB3.2/USB2.0/PCIe Gen.3×1)
|
AI Accelerator
|
– 1/2 Hailo-8 AI Card(by model)
Note: There are 2 HAILO-8 chips on each AI expansion card, Expansion through PCIe x 8 slot
|
Rear Panel I/O
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– 8* USB3.2 (Gen.2)
– 2* LAN
– 1* HDMI
– 1* Audio jack (Line-out/MIC combo)
– 1* DC-in (3 PIN Industrial Connector)
– 6* COM (2* RS232/422/485,4* RS232)
|
Front Panel I/O
|
– 1* Power button
– 1* Reset button
– 1* Power LED
– 1* HDD LED
– 2* USB 2.0
– 1* EXT FAN module link
|
Internal Connector
|
– SIM Card Holder
– 1* GPIO
|
Power Source
|
– Adapter: AC 90~240V input/DC19V_120W output
– MB: DC12~36V input
|
Compliance
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– CE, FCC, LVD, RoHS, ErP Ready
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Dimensions
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– System: 306 (W)* 199 (D)* 79 (H) mm
– Box: 406 (W)* 359 (D)* 148 (H) mm
– Net Weight: 5.5 KG
– Gross Weight: 6.5 K
|
Temperature
|
– Operating Temperature: -20 ~ 50° C
(Under the condition of using M.2 interface SSD)
– Storage Temperature: -40 ~ 85° C
– Humidity: 10% ~ 95% RH @40°C (non-condensing)
|
OS Support
|
– Windows 11, Linux
|